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An organization or plant in this era cannot avoid Electrostatic Discharge (ESD) / Electrical Over Stress (EOS) factors when running daily manufacturing activity. ESD problems are increasing in the electronics industry because of the trends toward higher speed and smaller device sizes which are sensitive to ESD. The product mostly consisting of IC component and ESD sensitive is a major concern where the failure trend related to ESD, is now become an alarming condition In this book, it defines the problem related to ESD facing by manufacturing company, measurement to justify the problem and improvement activity taken and suggestion to reduce the failure. This book suggest improvements in ESD protection which minimize yield losses and 0km failures. Findings from this book showed that virtually all materials, even conductors, can be triboelectrically charges. Electrostatic discharge can occur throughout the manufacturing test, shipping, handling, or operational process. With this improvement, failure trend at customer related to ESD shows a reducing trend.

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