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Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions

This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage.

Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact.

-Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics
-Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature
-Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications
-Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more
-A pivotal reference for professionals, engineers, students, and researchers

Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.

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Interconnects - Introduction
PART I. MATERIALS
Nano Ag
Ag-based Alloys
Au-based Alloys
Zn-based Alloys
Transient Liquid Phase
Polymer-based Joining
Nanotechnology-based Solutions
Intermetallic Compounds
PART II. PERFORMANCE ASSESSMENT
Lifecycle Assessment
High-Temperature Performance
Mechanical Performance
Under Bump Metallurgy (UBM) Engineering
Lead-Free Reliability
Simulation and Modelling

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Ahmed Sharif, PhD, has been working as faculty in the Department of Materials and Metallurgical Engineering at the Bangladesh University of Engineering and Technology since 1999. He is an international renowned scientist in joining technology, and has published more than fifty peer-reviewed papers in leading international journals in soldering and ferroelectric materials research. A part of his PhD research has led to the award of an international prize the "IEEE CPMT Young Scientist Award" for his paper presentation in an IEEE conference held in Japan in 2004.

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