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Common aim in the aerospace industry is to design and produce systems which have a life of at least 20 years with high reliability levels. The complex and fragile structure of electronic systems requires special attention in order to meet the expectations of the aerospace industry. In this study, vibration analyses of electronic assemblies that consist of an electronic box, printed circuit board and electronic components are presented. A detailed vibration analysis of a real electronic assembly is performed by finite element methods and vibration tests. Effects of component addition and component modeling are investigated by finite element analysis in detail. Results are compared in order to identify the most efficient, reliable and suitable method depending on the type of problem. Experimental results for the vibration of an electronic box, PCB and components are presented and discussed. Furthermore, an analytical model that represents a printed circuit board and electronic component is suggested for fixed and simply supported boundary conditions of the PCB. The validity of the analytical model is computationally checked by comparing results with those of finite element solution.

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Banu Teksen received BS and MSc degrees in Mechanical Engineering from Middle East Technical University (METU), Turkey. She is currently working as a senior research engineer in the aerospace industry. She is also a doctoral student at the Department of Mechanical Engineering at METU.

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