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Hari K. Pyla
High Performance Thermal-aware Distributed Computing
Aufl. 2012. 80 S.
Verlag/Jahr: AV AKADEMIKERVERLAG 2012
ISBN: 3-639-45256-9 (3639452569) / 3-8364-3559-4 (3836435594)
Neue ISBN: 978-3-639-45256-3 (9783639452563) / 978-3-8364-3559-8 (9783836435598)
Preis und Lieferzeit: Bitte klicken
Revision with unchanged content. The power consumption of large scale clusters is now a critical design constraint in high-performance clusters. This increased power consumption and system densities have multiple side effects including increased operational costs, higher average operating temperatures which decreased reliability of microelectronics and, this additional heat which must be dissipated by complex cooling systems. For example, the Arrhenius equation states a temperature increase of 10 degrees Celsius results in reliability decrease of an electronic device by 50 percent. In this book, we discuss and analyze answers to common questions like: What parts of my parallel application will benefit from thermal management techniques?, Where do I start optimizing my parallel application to reduce thermals?, Are the thermal properties of my application similar across machines in a cluster?, What and where are the performance effects of thermal optimizations on my application?, How do I regulate thermals within the threshold limits and yet maintain performance? Readers with a background in the computer science, electrical and electronics engineering find this book interesting.
is a doctoral student in the Department of Computer Science at Virginia Tech. He has a BA of Technology degree in Computer Science from Jawaharlal Nehru Technological Univ. in India and a MSc degree in Computer Science from Virginia Tech. His research areas include high performance computing, parallel processing and energy efficient distributed computing.