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Yi (Grace) Li, Kyoung-Sik Moon, C. P. Wong (Beteiligte)

Nano-Bio- Electronic, Photonic and MEMS Packaging


Herausgegeben von Wong, C. P.; Moon, Kyoung-Sik; Li, Yi (Grace)
2010. 2014. xi, 761 S. 235 mm
Verlag/Jahr: SPRINGER, BERLIN; SPRINGER US; SPRINGER 2014
ISBN: 1-489-98361-9 (1489983619)
Neue ISBN: 978-1-489-98361-9 (9781489983619)

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Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. This book offers an overview of nano and bio packaging. It includes a discussion of nano bio packaging materials and design with MD simulations.
Nanomaterials for Microelectronic and Bio-packaging.- Nano-conductive Adhesives for Nano-electronics Interconnection.- Biomimetic Lotus Effect Surfaces for Nanopackaging.- Applications of Carbon Nanomaterials as Electrical Interconnects and Thermal Interface Materials.- Nanomaterials via NanoSpray Combustion Chemical Vapor Condensation, and Their Electronic Applications.- 1D Nanowire Electrode Materials for Power Sources of Microelectronics.- Mechanical Energy Harvesting Using Wurtzite Nanowires.- Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectronic Packaging.- to Nanoparticle-Based Integrated Passives.- Thermally Conductive Nanocomposites.- Physical Properties and Mechanical Behavior of Carbon Nano-tubes (CNTs) and Carbon Nano-fibers (CNFs) as Thermal Interface Materials (TIMs) for High-Power Integrated Circuit (IC) Packages: Review and Extension.- On-Chip Thermal Management and Hot-Spot Remediation.- Some Aspects of Microchannel Heat Transfer.- Nanoprobes for Live-Cell Gene Detection.- Packaging for Bio-micro-electro-mechanical Systems (BioMEMS) and Microfluidic Chips.- Packaging of Biomolecular and Chemical Microsensors.- Nanobiosensing Electronics and Nanochemistry for Biosensor Packaging.- Molecular Dynamics Applications in Packaging.- Nanoscale Deformation and Strain Analysis by AFM/DIC Technique.- Nano-Scale and Atomistic-Scale Modeling of Advanced Materials.