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Thin-film electronics refer to devices composed from thin-films of active semiconductors, dielectrics and metallic connects that are deposited over a supporting substrate, frequently silicon or glass. Thin-film electronics are widely used for applications, ranging from solar cells, batteries, transistors, light emitting diodes to sensors. Fabrication of thin-film electronics on nonconventional substrates (e.g., papers, polymers, fabrics and metal sheets) presents exciting opportunities for realizing the next-generation of electronics, such as flexible displays, transparent touchscreen panels, wearable solar cells and bio-integrated electronics. However, fabrication of thin-film electronics on unusual substrates faces a significant challenge due to the mismatch between the device fabrication conditions and the tolerable processing conditions for the nonconventional substrates in terms of maximum temperature and chemical compatibility. To overcome this challenge, the transfer printing methods are developed and introduced here.

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Chi Hwan Lee received PhD and MS degrees in Mechanical Engineering at Stanford University and his BSE degrees in Mechanical and Industrial Engineering at Illinois Institute of Technology and Ajou University through dual degree program. He works as a postdoctoral researcher in Prof. John A. Rogers Group at University of Illinois at Urbana-Champaign.

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